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THERMAL INTERFACE MATERIALS

Things are heating up in electronics manufacturing – literally. The pace of device footprint reduction combined with consumer-driven increased functionality demands is pushing the thermal management capabilities of many packages to the brink. No doubt that effective heat transfer will be one of the most critical aspects of device design and manufacture in the coming decade.

Henkel’s thermal materials scientists have developed some unique and user-friendly products to address these thermal transfer priorities. The Loctite® line of Phase Change Thermal Interface Materials (PCTIM) offers exceptionally low thermal impedance between heat dissipating devices and the surface to which the component is mounted.  The premiere product in this line-up, Loctite Powerstrate® Xtreme™ adheres to heat sinks or components without heating, delivering amazing ease of use without compromising thermal performance.  For applications where the need for process convenience outweighs the need for PCTIM’s extremely low thermal impedance, Henkel’s portfolio of Loctite brand thermally conductive adhesives delivers user-friendly functionality with outstanding thermal conductivity.

Bond-Ply
Bond-Ply Products The Bond-Ply family of materials are thermally conductive and electrically isolating.  Bond-Ply is available in a PSA or laminating format.  Bond-Ply provides ...
Gap Pad
Gap Pad Products Henkel developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, ...
Hi-Flow
Hi-Flow Products Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between CPU or power devices and a heat sink. Hi-Flow materials change ...
LOCTITE Silverstrate
LOCTITE Silverstrate Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating ...
LOCTITE® 315
LOCTITE® 315™ LOCTITE® 315™ is a self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap. The ...
LOCTITE® 383
LOCTITE 383 LOCTITE 383 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat ...
LOCTITE® 3873
LOCTITE® 3873™ 3873TM is a self-shimming, thermally conductive adhesive. When used with Activator 7387TM, it cures rapidly to form a high strength, high modulus, thermoset ...
LOCTITE® 3874
LOCTITE® 3874™ LOCTITE® 3874™ is a thermally conductive adhesive. When used with Activator 7387TM, it cures rapidly to form a high strength, high modulus, thermoset ...
LOCTITE® 3875
LOCTITE® 3875 3875 bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components. It is ...
LOCTITE® 3876
Loctite® 3876™ Loctite® 3876™, self-shimming bead on bead thermally conductive adhesive, is a two-part filled acrylic thermally conductive adhesive designed for ...
LOCTITE® 5404
Loctite® 5404™ Loctite® 5404™ is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. Loctite® 5404™ applications include ...
LOCTITE® 7387
LOCTITE® 7387™ LOCTITE® 7387™ Depend® Activator is designed to initiate the cure of LOCTITE toughened acrylic adhesives such as LOCTITE® 315™, 383™ ...
LOCTITE® ECONOSTRATE
LOCTITE ECONOSTRATE LOCTITE EIF 5000 or also known as LOCTITE ECONOSTRATE is an electrically isolating phase change thermal interface material suitable for applications where thermal ...
LOCTITE® ISOSTRATE™
LOCTITE ISOSTRATE™ Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating ...
LOCTITE® Powerstrate
LOCTITE POWERSTRATETM Powerstrate pads outperform all other thermal interface materials, including thermal greases. These high efficiency, black-coloured pads are fully re-workable, ...
LOCTITE® Powerstrate Xtreme
LOCTITE TCF 4000 PXF (LOCTITE POWERSTRATE XTREME) LOCTITE TCF 4000 PXF is a reworkable phase change thermal interface material suitable for use between a heat sink and variety heat ...
LOCTITE® SILSTRATE
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LOCTITE® THERMSTRATE
LOCTITE THERMSTRATE® TC Thermstrate® TC is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This ...
Q-Pad® II
Q-Pad® II Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications ...
Sil-Pad
Sil-Pad Products More than 20 years ago, Henkel set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad. Today, Henkel is a world leader with ...