Authorized Distributor Products

> LOCTITE - Potting & Encapsulating

POTTING & ENCAPSULATING

Ekasurya Inout Indonesia has led a partnership and become an Authorized Distributor of Henkel LOCTITE® in Indonesia for more than a decade. Henkel is the world's innovation leader for potting solutions.

Henkel offers innovative solutions for any type of circuit board protection depending on specific requirement. All Henkel materials have been designed for ease of use and in a convenient package of dispense operation.

We brought Henkel leading brand - LOCTITE® - to fulfill your on demand and specific requirement especially in variety of electronics applications. 

AS 5375
TECHNOMELT AS 5375 (e) (Known as Macromelt AS 5375 ) TECHNOMELT AS 5375 (e) is used for general assembly applications. It is specially formulated for bonding and coating polypropylene ...
EO1016
HYSOL EO1016 EO1016 is an epoxy encapsulant intended for applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous ...
EO1061
HYSOL EO1061 EO1061 is designed to pass 1,000hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Exceptional viscosity stability at 25°C provides easier ...
EO1062
HYSOL EO1062 EO1062 is designed to pass 1,000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Exceptional viscosity stability at 25°C provides easier ...
EO1072
HYSOL EO1072 EO1072 has a unique rheology that allows the same product to be used as both a dam and fill encapsulant. It is intended for applications requiring excellent handling properties. EO1072 ...
FP4323
HYSOL FP4323 FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. FP4323 provides the following product ...
FP4401
HYSOL FP4401 FP4401 is a low flow, high purity liquid epoxy encapsulant. This material has a high glass transition temperature and low coefficient of thermal expansion which gives ...
FP4450
HYSOL FP4450 Hysol® FP4450 is high purity, low stress liquid encapsulant with good moisture resistance and an extended working life. It is designed for protection of bare semiconductor ...
FP4450HF
HYSOL FP4450HF FP4450HF encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending ...
FP4450LV™
HYSOL FP4450LV™ FP4450LV™ encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no ...
FP4451
HYSOL FP4451 FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. FP4451 used in combination with FP4450, FP4451 and other Henkel ...
FP4451TD
...
FP4470
HYSOL FP4470 FP4470 liquid encapsulant features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand ...
LOCTITE 3327
LOCTITE® 3327 LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, ...
OM633
TECHNOMELT PA 633 (e) (Known as Macromelt OM633 ) TECHNOMELT PA 633 (e) high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This ...
OM652
TECHNOMELT PA 652 (e) (Known as Macromelt OM652) TECHNOMELT PA 652 (e) high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This ...
OM673
TECHNOMELT PA 673 (e) (Known as Macromelt OM673) TECHNOMELT PA 673 (e) high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This ...
OM678
TECHNOMELT PA 678 (e) (Known as Macromelt OM678) TECHNOMELT PA 678 (e) high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This ...
OM682
TECHNOMELT PA 682 (e) (Known as Macromelt OM682) TECHNOMELT PA 682 (e) thermoplastic, hot melt adhesive is designed for molding compound applications. TECHNOMELT PA 682 (e) provides ...
OM687
TECHNOMELT PA 687 (e) (Known as Macromelt OM687) TECHNOMELT PA 687 (e) thermoplastic, hot melt adhesive is designed for molding compound applications. TECHNOMELT PA 687 (e) provides ...
UV8800
LOCTITE® UV8800M™ UV8800M™ epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It offers a hard translucent coating when exposed ...