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LOCTITE® 3874™

LOCTITE® 3874™ is a thermally conductive adhesive. When used with Activator 7387TM, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. Typical applications include bonding heat sinks to heat dissipating components such as BGAs in electronics applications. The thixotropic nature of LOCTITE® 3874™ reduces the migration of liquid product after application to the substrate

LOCTITE® 3874™ provides the following product characteristics: