Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds.
Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, Q-Pad II can be used prior to these operations. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup.
Features and Benefits
Typical Applications Include: