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Q-Pad® II

Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds.

Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, Q-Pad II can be used prior to these operations. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup.

Features and Benefits

  • Thermal impedance: 0.22°C-in2/W (@50 psi)
  • Maximum heat transfer
    Aluminum foil coated both sides
    Designed to replace thermal grease

Typical Applications Include:

  • Between a transistor and a heat sink
  • Between two large surfaces such as an L-bracket and the chassis of an assembly
  • Between a heat sink and a chassis
  • Under electrically isolated power modules or devices such as resistors, transformers and solid state relays