HYSOL FP4450

Hysol® FP4450 is high purity, low stress liquid encapsulant with good moisture resistance and an extended working life. It is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending upon device and package type. This material is designed for temperature cycling ranges up to -65°C to 150°C. Pot life or working life has been extended to approximately 3 days. This liquid epoxy exhibits relatively high flow. A cavity or a potting dam is required for flow control. Hysol® FP4450 may be suitable for bare chip protection in a variety of advanced packages such as IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, ball grid arrays and pin grid arrays. The high temperature performance and excellent resistance to chemicals, moisture and handling damage, are also advantageous for automotive applications.